Apr' 2024

Silicon University organizes a one-day hands-on session on ‘Printed Circuit Board (PCB) Design’

The Department of Electrical and Electronics Engineering (EEE) at SiliconTech, the engineering institute of Silicon University, collaborated with the Institute of Electrical and Electronics Engineers (IEEE) Students Chapter to organize a one-day hands-on session on ‘Printed Circuit Board (PCB) Design’ on 20 April 2024.

The objective of the session was to enable participants to grasp the best practices for designing a PCB layout, gain practical experience in designing single-sided and multilayer PCBs with Dual In-line Package (DIP) and Surface Mount Device (SMD) components, and comprehend the fundamental rules and files for PCB manufacturing.

The hands-on session was conducted by Mr. Kunal M, Founder & Director, Logiczap NextGen Technologies, Kolkata. He began the session with a brief introduction to software installation, component footprint, schematic diagram creation, basic software controls, and routing techniques. Participants acquired an understanding of both single-sided and multilayer PCB design processes. In the hands-on session, they successfully developed a multilayer PCB featuring DIP and SMD components for an adjustable voltage regulator, along with a single-sided PCB incorporating DIP and SMD components for an infrared sensor

A total of seventy three students participated in the session to acquire practical skills in designing both single-sided and multilayer printed circuit boards (PCBs). Additionally, they explored effective strategies for PCB layout design.